Header assembly for a pressure sensor

ABSTRACT

A header assembly for a pressure sensor and methods for manufacturing and using the same are provided. In one example embodiment, a header insert may include a base; a hollow protrusion coupled to the base and having a metalized inner surface and a metalized outer surface, wherein the metalized outer surface of the hollow protrusion is used to couple to a header and the metalized inner surface of the hollow protrusion is used to couple to a header pin; and wherein a seal is formed between the header, the header insert and the header pin.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.15/399,806, filed 6 Jan. 2017, entitled “Header Assembly for a PressureSensor,” and published as U.S. Patent Publication US 2017/0115176 on 27Apr. 2017. U.S. patent application Ser. No. 15/399,806 is a continuationof U.S. patent application Ser. No. 14/301,742, filed 11 Jun. 2014,entitled “Header Assembly for a Pressure Sensor,” published as U.S.Patent Publication US 2015/0101416 on 16 Apr. 2015, and issued as U.S.Pat. No. 9,566,656 on 14 Feb. 2017, the contents of which areincorporated herein by reference as if presented in full.

U.S. patent application Ser. No. 14/301,742 claims priority under 35U.S.C. § 119(e) to U.S. Prov. App. No. 61/889,671, entitled “ONE PIECECERAMIC HEADER INSERT,” filed 11 Oct. 2013, the contents of which ishereby incorporated by reference as if fully set forth herein.

TECHNICAL FIELD

The present invention relates generally to sensors and more particularlyto a header assembly for a pressure sensor and methods for manufacturingand using the same.

BACKGROUND

Traditional headers for pressure sensors are made either withglass-to-metal seals or brazed ceramic-to-metal seals. For example, FIG.1 shows a prior art glass-sealed metal header assembly 100. In FIG. 1,the header assembly 100 is configured to include a metal header 101, aheader pin 103 and a glass frit 105. The header 101 has the header pin103 sealed to the metal header 101 using the glass frit 105. The glassfrit 105 forms a compression seal where the glass frit 105 is compressedinside the metal header 101 after heating the metal header at hightemperature and allowing the assembly to cool to room temperature. Sincethe melting temperature of the glass frit 105 is much higher than theoperating temperature of the header assembly 100, the glass frit 105provides a seal over the full operating temperature range of the headerassembly 100. Current ceramic headers are similar to glass-sealedheaders except that the seals for the ceramic headers are made bybrazing a metalized ceramic to a metal header. Further, current ceramicheaders use individual pieces of metalized ceramic for each pin in theheader. Accordingly, there is a need for improved techniques relating toa header for a pressure sensor and methods for manufacturing and usingthe same. In addition, other desirable features and characteristics ofthe present disclosure will become apparent from the subsequent detaileddescription and claims, taken in conjunction with the accompanyingfigures and the foregoing technical field and background.

SUMMARY OF THE DISCLOSURE

Briefly described, embodiments of the present disclosure relate to aheader assembly for a pressure sensor and methods for manufacturing andusing the same. According to one aspect, a header insert may beconfigured to include a base and a hollow protrusion. The hollowprotrusion may have a metalized inner surface and a metalized outersurface. Further, the hollow protrusion may be coupled to the base. Themetalized outer surface of the hollow protrusion may be used to coupleto a header and the metalized inner surface of the hollow protrusion maybe used to couple to a header pin. Also, a seal may be formed betweenthe header, the header insert and the header pin.

According to another aspect, a header assembly by a process may beconfigured to include a header disposed around and defining an aperture,a header insert having a hollow protrusion, and a header pin. The headerassembly by the process may include metalizing an inner surface of thehollow protrusion to form a metalized inner surface. Further, the headerassembly by the process may include metalizing an outer surface of thehollow protrusion to form a metalized outer surface. The header assemblyby the process may include placing the header insert in the header suchthat the outer surface of the metalized hollow protrusion may bedisposed in the aperture and may be coupled to a surface of the headerassociated with the aperture. Further, the header assembly by theprocess may include placing the header pin in the hollow protrusion suchthat the metalized inner surface of the hollow protrusion may be coupledto the header pin. Finally, the header assembly by the process mayinclude brazing the metalized outer surface of the hollow protrusion tothe inner surface of the header and the metalized inner surface of thehollow protrusion to the header pin. Also, a seal may be formed betweenthe header, the header insert and the header pin.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure is illustrated by way of examples, embodimentsand the like and is not limited by the accompanying figures, in whichlike reference numbers indicate similar elements. Elements in thefigures are illustrated for simplicity and clarity and have notnecessarily been drawn to scale. The figures along with the detaileddescription are incorporated and form part of the specification andserve to further illustrate examples, embodiments and the like, andexplain various principles and advantages, in accordance with thepresent disclosure, where:

FIG. 1 shows a prior art glass-sealed metal header assembly.

FIGS. 2A, 2B and 2C illustrate one embodiment of a header insert inaccordance with various aspects as described herein. FIG. 2A provides atop view of one embodiment of the header insert. FIG. 2B provides alongitudinal cross-sectional view along section A-A of FIG. 2A of oneembodiment of the header insert. FIG. 2C provides a perspective view ofone embodiment of the header insert.

FIGS. 3A and 3B illustrate one embodiment of a header assembly inaccordance with various aspects as described herein. FIG. 3A provides atop view of one embodiment of the header assembly. FIG. 3B provides alongitudinal cross-sectional view along section A-A of FIG. 3A of oneembodiment of the header assembly.

FIG. 4 is a flowchart of one embodiment of a header assembly by aprocess in accordance with various aspects as described herein.

DETAILED DESCRIPTION

The following detailed description is merely illustrative in nature andis not intended to limit the present disclosure, or the application anduses of the present disclosure. Furthermore, there is no intention to bebound by any expressed or implied theory presented in the precedingfield of use, background, or summary of the disclosure or the followingdetailed description. The present disclosure provides various examples,embodiments and the like, which may be described herein in terms offunctional or logical block elements. Various techniques describedherein may be used for a header assembly for a pressure sensor andmethods for manufacturing and using the same. The various aspectsdescribed herein are presented as methods, devices (or apparatus), andsystems that may include a number of components, elements, members,modules, nodes, peripherals, or the like. Further, these methods,devices, and systems may include or not include additional components,elements, members, modules, nodes, peripherals, or the like.

Throughout the specification and the claims, the following terms take atleast the meanings explicitly associated herein, unless the contextclearly dictates otherwise. The terms “connect,” “connecting,” and“connected” mean that one function, feature, structure, orcharacteristic is directly joined to or in communication with anotherfunction, feature, structure, or characteristic. The terms “couple,”“coupling,” and “coupled” mean that one function, feature, structure, orcharacteristic is directly or indirectly joined to or in communicationwith another function, feature, structure, or characteristic. Relationalterms such as “first” and “second,” and the like may be used solely todistinguish one entity or action from another entity or action withoutnecessarily requiring or implying any actual such relationship or orderbetween such entities or actions. The term “or” is intended to mean aninclusive or. Further, the terms “a,” “an,” and “the” are intended tomean one or more unless specified otherwise or clear from the context tobe directed to a singular form. The term “include” and its various formsare intended to mean including but not limited to. The terms“substantially,” “essentially,” “approximately,” “about” or any otherversion thereof, are defined as being close to as understood by one ofordinary skill in the art, and in one non-limiting embodiment the termis defined to be within 10%, in another embodiment within 5%, in anotherembodiment within 1% and in another embodiment within 0.5%.

In the following description, numerous specific details are set forth.However, it is to be understood that embodiments of the disclosedtechnology may be practiced without these specific details. Referencesto “one embodiment,” “an embodiment,” “example embodiment,” “variousembodiments,” and other like terms indicate that the embodiments of thedisclosed technology so described may include a particular function,feature, structure, or characteristic, but not every embodimentnecessarily includes the particular function, feature, structure, orcharacteristic. Further, repeated use of the phrase “in one embodiment”does not necessarily refer to the same embodiment, although it may.

An example embodiment of the present disclosure, described herein,provides a header assembly for a pressure sensor and methods formanufacturing and using the same. For example, FIGS. 2A, 2B and 2Cillustrate one embodiment of a header insert 200 a-c in accordance withvarious aspects as described herein. FIG. 2A provides a top view of oneembodiment of the header insert 200 a. FIG. 2B provides a longitudinalcross-sectional view along section A-A of FIG. 2A of one embodiment ofthe header insert 200 b. FIG. 2C provides a perspective view of oneembodiment of the header insert 200 c. In FIGS. 2A, 2B and 2C, theheader insert 200 a-c may be configured to include a base 201, anaperture 203 and a hollow cylinder 205. The header insert 200 a-c may becomposed of a contiguous material such as a ceramic material, a metallicmaterial or the like. Further, the header insert 200 a-c may form a sealbetween a header and a header pin. In one example, the base 201 mayinclude a center thin disc of ceramic material. The base 201 may bedisposed around and may define the aperture 203 for a sensor such as apressure sensing chip. Also, the base 201 may be coupled to the hollowprotrusion 205 such as a hollow cylinder. The hollow protrusion 205 maybe used to form a seal between an inner surface of the hollow protrusion205 and a surface of a header pin. The hollow protrusion 205 may bemetalized on its outer surface for sealing to the header and also may bemetalized on its inner surface for sealing to the header pin.

Another embodiment of the current disclosure, described herein, providesa header insert disposed in a header and brazed into place. For example,FIGS. 3A and 3B illustrate one embodiment of a header assembly 300 a-bin accordance with various aspects as described herein. FIG. 3A providesa top view of one embodiment of the header assembly 300 a. FIG. 3Bprovides a longitudinal cross-sectional view along section A-A of FIG.3A of one embodiment of the header assembly 300 b. In FIGS. 3A and 3B,the header insert 200 a-c of FIGS. 2A, 2B and 2C may be inserted andcoupled to a header 311. The header 311 may be disposed around and maydefine an aperture 313. The header insert 200 a-c may be coupled to theheader 311 such that the hollow protrusion 205 a-c of the header insert200 a-c may be disposed in the aperture 313 of the header 311. Theheader pin 315 may be disposed in the hollow protrusion 205 a-c of theheader insert 200 a-c. Further, the header insert 200 a-c may beconfigured to include a groove in its body for ball bond wires between apressure sensing chip and the header pin 315. In traditionalimplementations, a separate ceramic component is used to help protectthe ball bond wires and also to displace oil volume from an oil filledheader. The current disclosure describes replacing this separate ceramiccomponent with the header insert 200 a-c. This may reduce manufacturingcomplexity in assembling the header assembly 300 a-b. Further, asingle-piece construction of the header insert 200 a-c may allow formore surface area over which to form a seal between the header insert200 a-c and the header 311. This increased surface area may provide abetter seal between the sides of the header insert 200 a-c and the sidesof the header 311, resulting in reduced pressure leaks.

In another embodiment, a header assembly may be configured to include aheader, a header insert and a header pin. The header may be disposedaround and may define an aperture. The header insert may include ahollow protrusion and may be disposed around and define an aperture fora pressure sensor. The header insert may be coupled to the header suchthat an outer surface of the hollow protrusion is coupled to an innersurface of the header associated with the aperture. The header pin maybe disposed in the hollow protrusion. The inner surface of the hollowprotrusion may be coupled to the header pin. A seal may be formedbetween the header, the header insert and the header pin and may be usedto reduce a pressure leak measured by the pressure sensor.

In another embodiment, a header insert may be composed of one contiguousceramic material.

In another embodiment, a header may be composed of a metallic material.

In another embodiment, a header assembly may be configured to include apressure sensor disposed in the aperture.

In another embodiment, a header insert may include a groove for a ballbond used to couple a contact of a pressure sensor to a header pin.

In another embodiment, an outer surface of a hollow protrusion of aheader insert may be brazed to an inner surface of a header.

In another embodiment, an outer surface of a hollow protrusion of aheader insert may be metalized.

In another embodiment, an inner surface of a hollow protrusion of aheader insert may be brazed to a header pin.

In another embodiment, an inner surface of a hollow protrusion of aheader insert may be metalized.

In another embodiment, an area of a seal formed between a header and aheader insert may be at least a surface area of an outer surface of ahollow protrusion of the header insert.

FIG. 4 is a flowchart of one embodiment of a header assembly by aprocess 400 in accordance with various aspects as described herein. Theheader assembly may be configured to include a header, a header insertand a header pin. The header assembly may be disposed around and maydefine an aperture. Further, the header insert may include a hollowprotrusion. In FIG. 4, the process 400 may start at, for instance, block401, where it may include metalizing an inner surface and an outersurface of the hollow protrusion of the header insert. At block 403, theprocess 400 may include placing the header insert in the header suchthat the metalized outer surface of the hollow protrusion is disposed inthe aperture and coupled to a surface of the header associated with theaperture. At block 405, the process 400 may include placing the headerpin in the hollow protrusion such that a metalized inner surface of thehollow protrusion is coupled to the header pin. At block 407, theprocess 400 may include brazing the metalized outer surface of thehollow protrusion to the inner surface of the header and the metalizedinner surface of the hollow protrusion to the header pin to form a seal.

In another embodiment, a header assembly by a process may includeplacing a pressure sensor in an aperture of a header insert.

In another embodiment, a header assembly by a process may includecoupling a contact of a pressure sensor to a header pin.

In another embodiment, a header assembly by a process may includeplacing a ball bond in a groove of a header insert. Further, the headerassembly by the process may include coupling a contact of a pressuresensor to the ball bond wire. Also, the header assembly by the processmay include coupling a header pin to the ball bond wire.

It is important to recognize that it is impractical to describe everyconceivable combination of components or methodologies for purposes ofdescribing the claimed subject matter. However, a person having ordinaryskill in the art will recognize that many further combinations andpermutations of the subject technology are possible. Accordingly, theclaimed subject matter is intended to cover all such alterations,modifications, and variations that are within the spirit and scope ofthe claimed subject matter.

Although the present disclosure describes specific examples,embodiments, and the like, various modifications and changes may be madewithout departing from the scope of the present disclosure as set forthin the claims below. For example, although the example methods, devicesand systems, described herein are in conjunction with a configurationfor the aforementioned header assembly for a pressure sensor and methodsfor manufacturing and using the same, the skilled artisan will readilyrecognize that the example methods, devices or systems may be used inother methods, devices or systems and may be configured to correspond tosuch other example methods, devices or systems as needed. Further, whileat least one example, embodiment, or the like has been presented in theforegoing detailed description, many variations exist. Accordingly, thespecification and figures are to be regarded in an illustrative ratherthan a restrictive sense, and all such modifications are intended to beincluded within the scope of the present disclosure. Any benefits,advantages, or solutions to problems that are described herein withregard to specific embodiments are not intended to be construed as acritical, required, or essential feature or element of any or all of theclaims. Any benefits, advantages, or solutions to problems that aredescribed herein with regard to specific examples, embodiments, or thelike are not intended to be construed as a critical, required, oressential feature or element of any or all of the claims.

What is claimed is:
 1. A header insert configured to couple to a header,the header insert comprising: a base with a metalized outer surfaceconfigured to seal with the header; and one or more hollow protrusions,each of the one or more hollow protrusions having a metalized innersurface configured to receive and seal with a corresponding header pin.2. The header insert of claim 1, wherein the one or more hollowprotrusions further comprise a metalized outer surface configured toseal with the header.
 3. The header insert of claim 2, wherein themetalized outer surface of the one or more hollow protrusions iselectrically separated from the metalized inner surface of the one ormore hollow protrusions.
 4. The header insert of claim 2, wherein themetalized outer surface of the base is configured to seal with a firstportion of the header, and wherein the metalized outer surface of theone or more hollow protrusions is configured to seal with a secondportion of the header.
 5. The header insert of claim 1, wherein the baseand the one or more hollow protrusions are composed of one contiguousmaterial.
 6. The header insert of claim 1, wherein the base and the oneor more hollow protrusions are composed of a ceramic material.
 7. Theheader insert of claim 1, further comprising an aperture configured foraccepting a pressure sensor.
 8. The header insert of claim 7, whereinthe base includes one or more grooves for accepting bond wire toelectrically couple one or more corresponding contacts of the pressuresensor to one or more corresponding header pins.
 9. The header insert ofclaim 1, wherein the header comprises a metallic material.
 10. Theheader insert of claim 1, wherein a shape of the hollow protrusion is acylinder.
 11. A method, comprising: metalizing an inner surface of ahollow protrusion of a header insert to form a metalized inner surface;metalizing a base of the header insert to form a metalized outersurface; placing the header insert in a header; placing a header pin inthe hollow protrusion; forming a first seal between the header pin andthe metalized inner surface of the hollow protrusion; and forming asecond seal between the metalized outer surface of the base and theheader.
 12. The method of claim 11, wherein the header insert iscomposed of one contiguous material.
 13. The method of claim 11, whereinthe header insert is composed of a ceramic material.
 14. The method ofclaim 11, further comprising placing a pressure sensor in an aperture ofthe header insert.
 15. The method of claim 14, further comprisingelectrically coupling the pressure sensor to the header pin.
 16. Themethod of claim 15, further comprising placing a ball bond wire in agroove of the header insert.
 17. The method of claim 16, furthercomprising coupling a contact of the pressure sensor to the ball bond.18. The method of claim 16, further comprising coupling the header pinto the ball bond wire.
 19. The method of claim 11, wherein an area ofthe seal formed between the header and the base is at least a surfacearea of an outer surface of the hollow protrusion of the header insert.20. The method of claim 11, wherein forming the seal comprises a singleprocess step.